AMD OPENCL DRIVER WINDOWS 7 UPDATE
According to anonymous sources of VideoCardz, MSI, one of NVIDIA's add-in board (AIB) partners, is preparing to update its SUPRIM X lineup of graphics cards with the MSI GeForce RTX 3090 Ti SUPRIM X GPU, scheduled for January 27th launch date. The upgraded version is supposed to max out the chip and bring additional performance to the table. In the past few months, we have heard rumors of NVIDIA launching an upgraded version of the GA102 silicon called GeForce RTX 3090 Ti.
Processors with 12 nm I/O dies, such as "Milan" and "Vermeer" could be retired only by 2023-24, as AMD will use 2022 to spread across its next-gen product launches. It will be very interesting to see if 12 nm-class I/O dies make it to next-generation products such as "Genoa" and "Rapael," which integrate the latest IP blocks such as PCI-Express Gen 5 root-complexes, DDR5 memory controllers, and 3rd Gen Infinity Fabric. The move to extend the WSA indicates that the company may continue to use 12 nm-class I/O dies in its processors for the foreseeable future. The update hence adds another year and $500 million worth supply.ĪMD currently sources 12 nm and 14 nm wafers from GlobalFoundries, which go into making cIOD and sIOD components in its processors, and motherboard chipsets. The previous version of the WSA saw commitments up to 2024, and wafers worth $1.6 billion. Under the latest agreement, AMD commits to buy $2.1 billion worth wafers from GlobalFoundries between 20. While current negotiations are ongoing and confidential, we plan to make an announcement as soon as possible." The Italian government is also said to have some concerns with regards to how many jobs the plant will actually create, as well as what the energy costs will be, which could throw a spanner in the works if Intel doesn't provide the right answers.ĪMD in its 8-K filing with the SEC, disclosed that it has updated its wafer supply agreement (WSA) with GlobalFoundries. When contacted by Reuters, Intel said "We are encouraged by the many possibilities to support the EU's digital agenda and 2030 semiconductor ambitions. Intel has already said it would invest around US$7 billion for a similar chip packaging plan in Penang, Malaysia, a location where Intel already has a chip packaging facility. This largely leaves Germany and France as the options for Intel's so called "megafab" that the company is planning to build in Europe over the next few years. Although Intel has already announced that it won't be making any decision with regards to its investments in Europe this year, new rumours courtesy of Reuters are now suggesting that Intel is eyeing Italy for an investment of €4 to €8 billion for a new, advanced semiconductor chip packaging plant.
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